INTRACOM DEFENSE has established and operates within its facilities a sophisticated Test Systems Engineering Laboratory designed to meet the most challenging test requirements imposed by Digital, Analog, RF and EO Equipment.
Test Systems Engineering team has successfully developed integrated testing solutions for a wide range of products and technologies in the areas of factory and depot-level maintenance testing with successful records.
Our Test Systems Engineering team possesses multiyear and remarkable professional experience in design, development and manufacturing of technology-edge Automated Test Equipment (ATE) and has good reputation throughout its international defense industry co-operations for technical innovation and service excellence.
More specifically, the Test Systems Engineering team specializes in customizing cost-effective unique or complex test solutions and support services to meet individual customer specifications and requirements.
- Design and integration of Tailored-made Test Stations
- Test Solutions Built to Customer specifications
- Upgrade and Refurbishment of existing Test Equipment as well as modernization of Automatic Test Equipment (ATE)
- Test Program Set (TPS) development
- Test stations training courses on Operation and maintenance Test stations integrated support services
Moreover the team participates in the refurbishment, upgrade and support of existing Test Equipment at customers’ premises.
Dedicated Test Systems core engineering team currently consists of experienced test engineers holding a college or masters degrees. The team is dynamically developing through continuous training and improvement, to offer quality turnkey solutions within schedule and cost objectives.
Testing capabilities cover the entire spectrum of electronics manufacturing such as:
- CCA (Circuit Card Assembly)
- SRU (Shop Replaceable Unit)
- LRU (Line Replaceable Unit)
- Cables/Rack Electrical testing
- Mechanical Assemblies
- System-Level testing
A wide area of electronics technologies and testing methodologies is covered, such as:
- High-speed digital electronics
- Analog Electronics
- Low and High Voltage Power Supplies
- Low and High-Power RF
In-Circuit Test (ICT)
- Boundary-scan (JTAG)
- In-Circuit Tests (Bed of Nails & Flying Probe)
Environmental Stress Screening (ESS) testing (operational or non-operational)
- Thermal cycling
- Combinations of the above
Instrumentation technology used is PXI/cPCI, CompactRIO, CompactDAQ, LXI, IEEE-488 (GPIB) and VXI. Software environment used for development includes LabVIEW, Labwindows CVI, Microsoft Visual C++, Test Studio® suite, Victory®, TestStand and INTRACOM Test GUI.
Among others, application areas include test development for all in house developed products as well as test solutions developed under contracts signed with the Hellenic MOD and key international partners for the co-production of Air Defense Systems, Missile Systems, Radar Systems and Land Weapon Systems.
A wide range of generic test platforms (COTS) and custom test stations and equipment is available, supporting both non-operational and fully operational test. Functional tests can be developed and performed in combination with Environmental Testing (ESS).
Environmental Testing – ESS can be performed according to International standards and customer testing conformance or special product requirements. For this function a variety of “state of the art” ESS equipment with associated interfaces is available, such as Cycling ovens, Thermal Shock Chambers, Vibration Systems, Altitude simulation chambers, Rain Chambers, etc.