The Company

INTRACOM DEFENSE (IDE) is clearly identified as a flexible volume, high performance, and cost effective manufacturer in defense and security area.

IDE’s manufacturing capabilities cover the entire spectrum of defense product operations with a remarkable ranking in the international defense systems market as a company with excellence in manufacturing infrastructure, high level of quality, flexibility, competitiveness, commitment in time schedules and focused on customer satisfaction.

Factors with significant contribution to the above achievements are Human Resources, Manufacturing Infrastructure and the established Process Control systems.

IDE invests in the continuous training and certification for all levels of the production personnel. More than 40% of the production personnel (Technicians, engineers, administrative and supporting personnel), are College and University graduates. Production personnel are trained and/or certified to international solder and assembly industry standards, such as IPC/J-STD-001D, IPC-7711, 7721, etc.

Continuous training programs are in place aiming to the improvement of personal knowledge, skills and expertise, in an effort to maintain position on the edge of technology.
The gained experience in the design of work systems and selection of manufacturing methods for optimum product flow ensures the achievement of High Quality within reasonable time and cost.

IDE Manufacturing Department consists of:

Industrial Engineering

Industrial Engineers involve with the development of Technical Capabilities, the continuous improvement of Quality and Productivity and the elimination of the waste of any kind. Main activities are the analysis, design and development of production methods, the selection manufacturing and installation of production equipment, the introduction of new products and validation of production operations, monitoring and analysis of technical characteristics, quality – productivity metrics and improvement proposals.

Test Engineering

Test Engineers have design and technical support skills for providing integrated solutions and services in the Product and Systems Testing field for a wide range of applications and technologies. Testing areas cover functional testing for high-speed digital electronics, analog electronics, low and high voltage power supplies, low and high-power RF as well as boundary-scan (JTAG), in-circuit and extensive ESS (Environmental Stress Screening) testing, including full operational test during thermal cycling, vibration and thermal shock. Testing capabilities can cover CCA (Circuit Card Assembly) and LRU (Line Replaceable Unit) level, as well as system-level testing.

The company has acquired considerable expertise in a wide range of industrial testing operations, developing and manufacturing advanced and modern testing solutions (Testers) which cover all the test specifications for every manufactured product.

Production Planning and Scheduling

Integrated Production Planning and Control is performed via the company’s (Enterprise Resource Planning) System, SAP R3.

Manufacturing Plants

The Manufacturing Plants section is responsible for the management of all operations within IDE production plants.
The total Manufacturing floor space is 7500m2, laid out in two production plants. This infrastructure includes an impressive and diverse number of manufacturing and testing equipment, which guarantees manufacturing of high quality products to the most strict and demanding specifications. Production lines are designed for optimum product flow, aiming to productivity improvements. The products and processes are monitored and tested for specification compliance, at critical control points utilizing automatic test equipment and Computer Aided techniques.

Production Capabilities

The existing production capabilities are the outcome of a continuous and vigorous investment program which includes the purchase of new equipment and development of new production methods and techniques with state of the art production automation. The areas covered are the following:

Printed Board Assemblies

  • Surface Mount Technology assembly lines
  • Reflow and Vapor Phase Soldering
  • Wave Soldering (ROHS and Conventional)
  • Press Fit Components
  • Manual assembly lines
  • PBA Repair and Rework Centre per IPC7711 and IPC7721.

Cable and Harness Assembly

  • Automated Cut and Stripping Machines
  • Variety of semi-automatic and special hand tools
  • Harness assembly, Coaxial(RF), Power, Signal Distribution, Special Purpose Cables
  • Semi rigid Cables

Magnetic Manufacturing

  • Coil and Transformer winding Machines
  • Manual assembly
  • Automatic Test
  • Impregnation

Electromechanical Products

  • Manual assembly of electromechanical products (Racks, Panels, Cabinets, etc.)
  • Standard Rework Procedures for Mechanical parts.

Special Processes

In order to improve the mechanical and environmental durability of the products, a number the following special processes are performed with the application of chemical compounds in a controlled environment using trained-qualified personnel and specific to type automatic equipment.

  • Application of Conformal Coating
  • Application of Bonding Materials
  • Cleaning and Cleanliness Measurements
  • Potting / Molding
  • BGA Underfilling
  • Micro-blasting

Special Facilities

Clean Rooms

Processes which require a clean and controlled environment (for optical parts, contamination sensitive products, etc) are performed in the existing clean room areas with ISO cleanliness class levels 7 & 8.

System Integration and Test

System integration and test operations (vehicles, shelters, etc) are performed in a special industrial area equipped with the relevant facilities and a 10 tons overhead crane.

Automatic Test & Inspection Equipment

  • Soldering processes (X-Ray 2D Inspection)
  • In-Circuit Testing (bed of nails, flying probe)
  • Electrical Testing
  • Functional Testing
  • Final Testing
  • Environmental Testing (Thermal – Mechanical Stress, Rain and Altitude Simulations)

Printed Circuits Board Production
IDE operates a Printed Circuit Boards Unit to meet the requirements for high standard and fast turn-around production of prototype boards and limited quantities of multilayer boards. The production meets the IPC-600 standard.